{"id":35592,"date":"2026-10-19T09:04:15","date_gmt":"2026-10-19T07:04:15","guid":{"rendered":"https:\/\/webex4.ims-chips.de\/ims_chips\/completed-projects\/"},"modified":"2026-10-28T15:08:55","modified_gmt":"2026-10-28T14:08:55","slug":"completed-projects","status":"publish","type":"page","link":"https:\/\/ims-chips.de\/en\/rd\/completed-projects\/","title":{"rendered":"Completed Projects"},"content":{"rendered":"\t\t
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Completed Projects<\/h2>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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<\/span>2025<\/span><\/summary>
\"HyPerStripes<\/div>

HyPerStripes \u2013 intelligent and flexible cables<\/h3>

HyPerStripes develops, evaluates and delivers technologies for long smart and flexible electronic systems that replace conventional cables and enable new products for applications with complex connections. The need for these technologies is particularly urgent in medical instruments, which now enable excellent diagnostics and therapies due to miniaturization. <\/p>\n<\/div>

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Projektzeitraum<\/span>April 1, 2022 \u2013 March 31, 2025<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF, VDI<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16ME0469<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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<\/span>2024<\/span><\/summary>
\"QIND<\/div>

QIND - Quantum sensors for industrial application in process technology<\/h3>

QIND is focuses on the further development of sensors for industrial applications in process technology. These are often required in bulk industrial production, for example in the food and pharmaceutical sectors. The sensors require high accuracy as well as high robustness and reliability. <\/p>\n<\/div>

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Projektzeitraum<\/span>December 1, 2021 \u2013 November 30, 2024<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>03ZU1110EB<\/span><\/div><\/div><\/div><\/div><\/article>
\"QQSCALE<\/div>

QQSCALE - Enabling technologies for scalable diamond quantum sensors<\/h3>

The microelectronic and photonic integration of NV-center-based sensors pursued in the QSCALE project focuses on one of the central tools to increase the scalability of a sensor technology, because the integration offers immense potential to reduce the size and power consumption of the sensor.<\/p>\n<\/div>

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Projektzeitraum<\/span>November 1, 2021 \u2013 October 31, 2024<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>03ZU1110ID<\/span><\/div><\/div><\/div><\/div><\/article>
\"QSCALE<\/div>

QSCALE - Enabling technologies for scalable diamond quantum sensors<\/h3>

The microelectronic and photonic integration of NV-center-based sensors pursued in the QSCALE project focuses on one of the central tools to increase the scalability of a sensor technology, because the integration offers immense potential to reduce the size and power consumption of the sensor.<\/p>\n<\/div>

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Projektzeitraum<\/span>November 1, 2021 \u2013 October 31, 2024<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span> 03ZU1110GC<\/span><\/div><\/div><\/div><\/div><\/article>
\"ID2PPAC<\/div>

ID2PPAC \u2013 Integration of Processes and Modules for the 2-nm Node<\/h3>

The ECSEL consortium project ID2PPAC, funded by the European Union and the German Federal Ministry of Education and Research (BMBF) with just under \u20ac48 million, consolidates and integrates the technological solutions for the 2-nm node identified in the predecessor project IT2. The goal is to demonstrate that the performance, power, area, and cost (PPAC) requirements for this new generation of leading-edge logic technology can be met.<\/p>\n<\/div>

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Projektzeitraum<\/span>June 1, 2021 \u2013 May 31, 2024<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>EU ECSEL Innovation Action Program<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>101007254<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2023<\/span><\/summary>
\"SpektroChip<\/div>

SpektroChip - Novel micro-spectrometer system for the near-infrared (NIR) range<\/h3>

The goal of the SpektroChip project is to develop, build, and demonstrate a novel micro-spectrometer system for the near-infrared (NIR) range for lab-on-a-chip applications in biomedicine.<\/p>\n<\/div>

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Projektzeitraum<\/span>September 1, 2022 \u2013 August 31, 2023<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>Vector Foundation<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>P2022-0250<\/span><\/div><\/div><\/div><\/div><\/article>
\"DoRiE<\/div>

DoRiE - AI for sensor-related applications<\/h3>

Edge AI requires efficient data processing using specialized hardware accelerators, which are available in the project as scalable components designed, for example, to be particularly energy-efficient or very fast. Every industrial application requires a precisely tailored implementation of the Edge AI solution. The project demonstrates how different implementations can be realized quickly and flexibly using an Edge AI modular system. <\/p>\n<\/div>

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Projektzeitraum<\/span>07.05.2021-30.06.2023<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>State of Baden-W\u00fcrttemberg<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span> Ref. No. 3-4332.62-IMS\/57<\/span><\/div><\/div><\/div><\/div><\/article>
\"PanaMEA<\/div>

PanaMEA - intelligent blood sugar level monitoring<\/h3>

The aim of the BMBF-funded project is the development of an intelligent implant to measure blood sugar levels up to the in vivo proof of concept. The electrical activity of the islets of Langerhans in the pancreas is a measure for the blood sugar level and is to be measured in the body by means of an ASIC. IMS CHIPS will be responsible for the development and sample production of this ASIC. <\/p>\n<\/div>

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Projektzeitraum<\/span>April 1, 2020 \u2013 December 31, 2023<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>13GW0397F<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2022<\/span><\/summary>
\"Particle<\/div>

Particle sensor - developing a highly-integrated portable system for real-time analysis of the ambient air<\/h3>

In order to effectively prevent allergic reactions and tailor treatment strategies optimally, it is crucial to have the most detailed information possible about the local exposure profile. Systems for determining pollen concentrations on a small-scale or even individual level have not been available to date due to a lack of suitable measurement and instrumentation technology.
The project aims to develop a miniaturized, fully automated system for the real-time detection and analysis of airborne particulate matter\u2014including fine dust and allergy-relevant pollen species\u2014in ambient air. The goal is to achieve extreme miniaturization compared to the current state of the art. <\/p>\n

Partners: RED GmbH, Reiser GmbH, inIT (Lemgo), Vanguard Photonics GmbH<\/p>\n<\/div>

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Projektzeitraum<\/span>01.02.2019-31.01.2022<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>ZIM\/AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>ZF4429204GM8<\/span><\/div><\/div><\/div><\/div><\/article>
\"TAPES3<\/div>

TAPES3 - Technology Advances for Pilotline of Enhanced Semiconductors for 3 nm<\/h3>

The main objective of the TAPES3 project is to develop and demonstrate lithography, metrology, EUV mask technology, equipment, and process modules for the 3-nm technology node. This is planned to be achieved using available EUV \/ NA=0.33 scanners, as well as through the system design and integration of a new hyper-NA EUV lithography tool, in order to enable more individual exposures at 3 nm for the fabrication of complex integrated circuits. <\/p>\n<\/div>

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Projektzeitraum<\/span>01.10.2018-31.01.2022<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>EU \/ BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>783247 \/ 16ESE0289<\/span><\/div><\/div><\/div><\/div><\/article>
\"OPALID<\/div>

OPALID - Optical Phased Array LiDAR<\/h3>

The BMBF sponsored project \u201cOPALID\u201d was launched October 1st, 2018. The overall project\u00b4s focus is on the research and development of a small, reliable and cost-efficient LiDAR system without moving parts for the optical sensor technology in Industrie 4.0 and a flexible networked production. <\/p>\n<\/div>

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Projektzeitraum<\/span>October 1, 2018 \u2013 September 30, 2022<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>13N14587<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2021<\/span><\/summary>
\"INOSENS<\/div>

INOSENS \u2013 Research on an innovative optical rotation angle sensor<\/h3>

Miniaturized encoder angle sensors are on the advance. Thus, rotary angle sensors with very high resolution are already commercially available today. The goal is to further increase the resolution of a miniaturized optical encoder by interpolation and to detect possible failures early on with additional sensor information. <\/p>\n

The IMS CHIPS is responsible for the development and commissioning of the Opto-ASIC in the INOSENS project. The Opto-ASIC consists of a multitude of integrated photodiodes and mixed-signal circuit elements for the determination of the rotation angle position and the implementation of additional functions. <\/p>\n<\/div>

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Projektzeitraum<\/span>01.12.2019-31.11.2021<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>Ref. 62402\/005-04#944<\/span><\/div><\/div><\/div><\/div><\/article>
\"MOCVD<\/div>

MOCVD 4.2 - technology for applications in power electronics<\/h3>

The main objective of the overall project is an increase in production capability of the MOCVD (Metal Organic Chemical Vapour Deposition) technology for applications in power electronics, in photo voltaic as well as in nano photonics and sensor technology. The technology targets the energy and e-Mobility sectors. An improvement of the technology is to be achieved through an industry 4.0 approach, which basically means networked and automated machine designs, intelligent software, analyses along detection limits and precise process control.
Electronic power converters will serve as demonstrator. In a production-related environment the possible solution are critically tested and evaluated in a real-life situation. In order to implement and verify the improvements modern GaN-based power transistors on silicon substrates are used, manufactured and analyzed.
This industry-oriented approach under production-related conditions for 200 mm wafers ensures real-life development with a high implementation potential. <\/p>\n<\/div>

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Projektzeitraum<\/span>01.01.2019-31.12.2021<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>0324237C<\/span><\/div><\/div><\/div><\/div><\/article>
\"POSITION-II<\/div>

POSITION-II \u2014 A pilot line for the next generation of smart catheters and implants<\/h3>

It is the ambition of POSITION project to enable innovation in Smart Catheters and Implants by the introduction of open technology platforms for: miniaturization, in-tip AD conversion, wireless communication, MEMS transducer technology and encapsulation. These platforms are open to multiple users and for multiple applications. <\/p>\n

The IMS will be responsible for the development and start-up of the ASICs within the subproject \u201cdigital MRI-safe EP catheter\u201d. Up to 96 electrical signals of the heart will be read-out, digitized and accessible via optical fiber. <\/p>\n

POSITION-II has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union.<\/p>\n<\/div>

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Projektzeitraum<\/span>01.01.2019-31.12.2021<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>0324237C<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2020<\/span><\/summary>
\"NeMoH<\/div>

NeMoH \u2013 Microelectronics for AI \u2013 Neuromorphic Hardware<\/h3>

In the project \u201cMicroelectronics for AI \u2013 Neuromorphic Hardware,\u201d funded by the state of Baden-W\u00fcrttemberg, three industry-aligned research institutes of the Baden-W\u00fcrttemberg Innovation Alliance are researching and developing adaptive, secure, and energy-efficient AI chips.<\/p>\n

These are considered a fundamental prerequisite for applications in the fields of Industry 4.0 and the Internet of Things (IoT). The project is coordinated by the Institute for Microelectronics Stuttgart (IMS CHIPS). In collaboration with the Research Center for Information Technology (FZI) and the Hahn-Schickard Society for Applied Research e. V., and supported by an industry advisory board, the project was launched in mid-2019. <\/p>\n

The institute contributes its expertise in the design of complex integrated circuits, measurement technology, and the development of intelligent microsystems. As part of the project, IMS CHIPS will develop ASICs capable of acquiring and preprocessing analog input signals and further processing them using a neuromorphic approach based on an evaluation platform. <\/p>\n<\/div>

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Projektzeitraum<\/span>25.06.2019-31.12.2020<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>State of Baden-W\u00fcrttemberg<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>Ref. No. 3-4332.62-IMS\/53<\/span><\/div><\/div><\/div><\/div><\/article>
\"MULTI-3D<\/div>

MULTI-3D \u2013 focus-modulating 3D sensor system<\/h3>

As part of the sponsoring program \u201cPhotonik Forschung Deutschland\u201d the research project MULTI-3D will be developing a micro-optical 3D sensor system to determine and\/or measure 3D objects.<\/p>\n

The \u201cHigh-dynamic linear CMOS image sensor\u201d project part will have Institut f\u00fcr Mikroelektronik Stuttgart developing an image sensor that is able to acquire a very high dynamic range. Just like many other image acquisition processes the anticipated micro-optical 3D sensor system will be able to record a very high luminance range of the detected objects as well as an interfering light of the surrounding conditions.
Project partners are SICK AG, GBS GmbH, Fraunhofer IOF and Friedrich-Schiller Universit\u00e4t Jena. <\/p>\n<\/div>

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Projektzeitraum<\/span> February 1, 2017, through December 31, 2020<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>13N14227<\/span><\/div><\/div><\/div><\/div><\/article>
\"Fiber<\/div>

Fiber Coupling \u2013 Photonic interconnection technology with optimized coupling efficiency<\/h3>

Photonics components are connected via optical signaling using optical fibers that couple light into the chips via microscopic structures (lattice couplers). The efficiency of this fiber coupling plays a decisive role in determining the overall properties of the circuit. Currently, there is a trade-off between the required coupling efficiency and the throughput capabilities of the corresponding procedures (optical fibers must be precisely aligned and attached in six axes). The goal of the project is to develop novel grating couplers with exceptionally high coupling efficiency that, through mass-production-ready processes and methods, simultaneously meet future cost requirements. The core idea is to use specialized laser-assisted etching processes to create guide structures in the form of buried structures within the wafer, into which the fibers are inserted. <\/p>\n

IMS CHIPS is tasked with developing an etching process that removes laser-treated structures in silicon with greater selectivity than the untreated structures. The development work within the scope of the project focuses on individual process steps in a known manufacturing sequence. <\/p>\n<\/div>

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Projektzeitraum<\/span>01.11.2018-31.10.2020<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span> ZIM\/AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>ZF4429203DF8<\/span><\/div><\/div><\/div><\/div><\/article>
\"HDRC-AeroPantoCam\"<\/div>

HDRC-AeroPantoCam<\/h3>

Photonics components are connected via optical signaling using optical fibers that couple light into the chips via microscopic structures (lattice couplers). The efficiency of this fiber coupling plays a decisive role in determining the overall properties of the circuit. Currently, there is a trade-off between the required coupling efficiency and the throughput capabilities of the corresponding procedures (optical fibers must be precisely aligned and attached in six axes). The goal of the project is to develop novel grating couplers with exceptionally high coupling efficiency that, through mass-production-ready processes and methods, simultaneously meet future cost requirements. The core idea is to use specialized laser-assisted etching processes to create guide structures in the form of buried structures within the wafer, into which the fibers are inserted. <\/p>\n

IMS CHIPS is tasked with developing an etching process that removes laser-treated structures in silicon with greater selectivity than the untreated structures. The development work within the scope of the project focuses on individual process steps in a known manufacturing sequence. <\/p>\n<\/div>

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Projektzeitraum<\/span> 01.07.2018-30.06.2021<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span> ZIM\/AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>ZF4429202GR8<\/span><\/div><\/div><\/div><\/div><\/article>
\"FLEXMAX<\/div>

FLEXMAX \u2013 flexible active sensor matrix for medical applications<\/h3>

The BMBF-funded \u201cFLEXMAX\u201d project began on April 1, 2018.
Flexible sensor films can provide valuable signals to physicians for monitoring the respiration of premature infants. The goal of the project is to develop flexible sensor films that can adapt very well to irregular or variable surface shapes. This will be demonstrated in two use cases using medical demonstrators. As part of the \u201cSmart Health\u201d funding program of the Federal Ministry of Education and Research, the project proposal was given the highest priority, and 2.1 million euros in funding was allocated for the research and development of medical demonstrators. <\/p>\n

IMS CHIPS is developing customized evaluation ICs to control and analyze the sensor signals as well as integrating its expertise in technologies to embed ultra-thin chips into the foil system.<\/p>\n<\/div>

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Projektzeitraum<\/span> April 1, 2018 \u2013 June 30, 2021<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16ES0775<\/span><\/div><\/div><\/div><\/div><\/article>
\"BW-CPS<\/div>

BW-CPS \u2013 smart intelligent energy-efficient sensor systems<\/h3>

The \u201cBW-CPS\u201d project (CPS = cyber-physical systems) is an initiative funded by the state of Baden-W\u00fcrttemberg to develop a modular system for intelligent and energy-efficient sensor technology for Industry 4.0: The potential of the modular system for the factories of the future is demonstrated through four specific use cases. The focus is on monitoring energy flows, controlling HVAC systems, collecting process data in injection molding tools, and optimizing intralogistics through localization and navigation components. And all of this is done in close cooperation with industry, which benefits from having all the developed functions at its disposal.
In addition to IMS CHIPS, the FZI and Hahn-Schickard are also participating in the BW-CPS project. <\/p>\n<\/div>

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Projektzeitraum<\/span>April 7, 2017 \u2013 February 29, 2020<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BW (MFW)<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>3-4332.62-HSG\/77<\/span><\/div><\/div><\/div><\/div><\/article>
\"GaNScan<\/div>

GaNScan \u2013 mapping and modeling of GaN\/Si wafers for power electronic applications<\/h3>

As part of the GaNScan project under the SME Innovation Program, the goal is to fabricate and study transistors and test structures on silicon wafers with epitaxial layers of the compound semiconductor gallium nitride (GaN). These structures will be used for spatially resolved measurement (mapping) of test and device parameters. The goal is to investigate new structures and expand measurement expertise to extract key parameters. The extracted parameters allow conclusions to be drawn about the quality and properties of the substrate and the epitaxial layer. This important information is fed back to the epitaxial suppliers and is used to improve the reliability and quality of the transistors. The project partners are RoodMicrotech (project coordination, SME), AdMOS (SME), and IMS CHIPS. <\/p>\n<\/div>

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Projektzeitraum<\/span>September 1, 2017 \u2013 February 29, 2020<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16ES0745<\/span><\/div><\/div><\/div><\/div><\/article>
\"C-GaN<\/div>

C-GaN \u2013 Complementary GaN Transistors for Logic Devices in High-temperature<\/h3>

The scope of the \u201cC-GaN\u201d project in cooperation with RWTH Aachen University (Compound Semiconductor Technology, Lehrstuhl f\u00fcr H\u00f6chstfrequenzelektronik) is to explore the technical and physical limits of complementary gallium nitride (GaN) transistors for logic devices in high-temperature (temperatures up to 1000 \u00b0C) and high-frequency applications.
High-temperature applications, such as aerospace components, automotive electronics and oil drilling equipment, exceed temperature limits know in conventional silicon technology. Logic devices based on GaN can be implemented in high-temperature and high-frequency applications due to the outstanding material properties of GaN. In order to reach this goal a heterogeneous academic consortium has formed bringing together leading scientific groups in the field of nitride materials and device technology, high-temperature characterization and packaging technology, and also, RF testing, modelling and circuit design. <\/p>\n<\/div>

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Projektzeitraum<\/span>May 1, 2017 \u2013 January 31, 2020<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>DFG<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>AL 1989\/2-1 (DFG)<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2019<\/span><\/summary>
\"Energy<\/div>

Energy filter \u2013 Development of large-scale energy filter membrane for single wafer ion implant in silicon carbide<\/h3>

In a ZIM-promoted project the IMS and the new start-up mi2-factory are joining together for technological processes on the high-energy ion implantation of SiC power semiconductors. The focus, however, is on the Stuttgart-based development of large-scale and high-precision Si membrane masks, so-called energy filter membranes.
The energy-filtered single-wafer ion implantation process was developed at mi2 factory and successfully applied in the manufacture of SiC power components.
The developmental focus at IMS CHIPS will be on the following topics in the next few years: yield, no defects, original wafer and stress-optimized layout. <\/p>\n<\/div>

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Projektzeitraum<\/span>April 1, 2017 \u2013 March 31, 2019<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>AIF Projekt, LLC<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>ZF4429201GM7<\/span><\/div><\/div><\/div><\/div><\/article>
\"TAKEMI5<\/div>

TAKEMI5 \u2013 technology Advances and Key Enablers for Module Integration for 5 nm<\/h3>

The main objective of the TAKEMI5 project is to research, develop, and demonstrate lithography, metrology, process, and integration technologies for the 5-nm node, in line with the requirements of the industry, Moore\u2019s Law, the scaling targets in ITRS 2013\/2015, and the ECSEL Ju MASP 2016.
This will be achieved using available EUV \/ NA0.33 scanners, which are optimized for use with existing DUV \/ NA1.35 scanners, and through the system design and development of a new EUV lithography tool for NA exposure, thereby enabling more single-exposure patterns at 5 nm to create complex integrated circuits.
The Institute for Microelectronics Stuttgart (IMS) will contribute to the Lithography and Mask Infrastructure work packages. In the Lithography work package, ultra-precise diffractive optical elements (DOEs) will be developed for the surface inspection of EUV mirrors, while the IMS will explore new concepts for mask architecture in the Mask Infrastructure work package. The TAKEMI5 project falls under the ECSEL work program topic \u201cProcess Technologies \u2013 More Moore.\u201d
The ECSEL project is accompanied by a parallel BMBF project. <\/p>\n<\/div>

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Projektzeitraum<\/span>April 1, 2017 \u2013 June 30, 2019<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span> EU<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>737479<\/span><\/div><\/div><\/div><\/div><\/article>
\"\u00b5HTS-CAN<\/div>

\u00b5HTS-CAN \u2013 micro High Troughput Screening Cell Adhesion Noise-(Spectroscopy)<\/h3>

The KMU-Innovativ project \u00b5HTS-CAN is to develop a CMOS microchip-based imaging system for a speedy analysis of biological cells. This project is part of the Biotechnologie-BioChance sponsorship activities. <\/p>\n

IThis sub-project in which Institut f\u00fcr Mikroelektronik Stuttgart cooperates develops and tests processes to reliably create micro-structured surface structures from permanent photo resists (dry film resist) with integrated reference electrodes on Si chips.
It is the goal to create impermeable and bio-compatible compartments on CMOS analyzing chips for the incooperation of the cells. These structures are to be adjusted in form and size depending on the chip design and client requirement. Project partners are Venneos GmbH and Hahn-Schickard-Gesellschaft f\u00fcr angewandte Forschung e.V. <\/p>\n<\/div>

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Projektzeitraum<\/span> February 1, 2017, through July 31, 2019<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>031B0285B<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2018<\/span><\/summary>
\"innBW<\/div>

innBW implant \u2013 Chip-in-Foil systems for bioelectronic medicine<\/h3>

Bioelectronic microimplants are increasingly becoming a focus of medical research. These tiny devices, about the size of a fingernail, can locally stimulate the nervous system electrically and are thus used to treat pain, migraines, and depression, but can also be effective in managing diabetes or high blood pressure. However, they are still in the very early stages of development. A research consortium comprising four institutes of the Baden-W\u00fcrttemberg Innovation Alliance (innBW) now aims to change that. The research project, called \u201cinnBW implant,\u201d launched on July 1 and is funded by the Baden-W\u00fcrttemberg Ministry of Finance and Economic Affairs with a total of 3.65 million euros. <\/p>\n<\/div>

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Projektzeitraum<\/span>July 1, 2015 \u2013 December 31, 2018<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>State of Baden-W\u00fcrttemberg (MFW)<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>7-4332.62-NMI\/49<\/span><\/div><\/div><\/div><\/div><\/article>
\"NEMEZU<\/div>

NEMEZU \u2013 new precious metal-free membrane electrode units for future fuel cells<\/h3>

The NEMEZU project will be researching and developing new precious metal-free membrane electrode units for alkaline fuel cells of the future.<\/p>\n

With a laser ablation on specially-selected precious metal-free materials and alloys the mass-implemented and cost-effective manufacture of catalytic layers for the use of micro-fuel cells will be developed. The effectiveness of alkaline fuel cells will be determined and measured during operation using infrared thermography of electro-chemical reactions.
The Institut f\u00fcr Mikroelektronik Stuttgart will be developing and producing Si3N4 membrane systems on 150 mm wafer to evaluate precious metal-free catalytic systems during fuel cell operations. <\/p>\n<\/div>

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Projektzeitraum<\/span>Dec. 1, 2015 \u2013 Nov. 31, 2018<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>03SF0497D<\/span><\/div><\/div><\/div><\/div><\/article>
\"<\/div>

ParsiFAl 4.0 \u2013 Product-capable autonomous and safe foil systems for automation solutions in Industrie 4.0<\/h3>

IMS CHIPS has joint partners in the ParsiFAl 4.0 research project on the development of new sensors and electronics on thin foil.<\/p>\n

The ParsiFAl 4.0 research project which is supported by the Bundesministerium f\u00fcr Bildung und Forschung comprises several partners supported by the project administrator VDI\/VDE-IT on the development of thin electronics systems, i e. Smart Sensor System (S3) labels. The foundation for S3 labels is micro controllers, sensors, thin displays and integrated communication interfaces, all of which are embedded into foils. The ascertained data can determine a component\u00b4s condition and, therefore, maintain equipment pro-actively. This reduces maintenance fees on production equipment significantly. Thus, transportation of critical goods can be tracked safely in the logistic and packaging field. <\/p>\n<\/div>

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Projektzeitraum<\/span>November 1, 2015 \u2013 October 30, 2018<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>VDI\/VDE-IT<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16ES0435<\/span><\/div><\/div><\/div><\/div><\/article>

SeNaTe \u2013 Seven Nanometer Technology<\/h3>

SeNaTe is divided into six work packages focused on lithography, metrology, process, EUV mask infrastructure, and 7 nm process demonstration; one work package is dedicated to project management.
The Institute for Microelectronics Stuttgart (IMS) will participate in the Lithography and Mask Infrastructure work packages. In the lithography work package, ultra-precise diffractive optical elements (DOEs) will be developed for the surface inspection of EUV mirrors, while in the mask infrastructure work package, the IMS will investigate new concepts for mask architecture.
The ECSEL project is supported by a parallel BMBF project. <\/p>\n<\/div>

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Projektzeitraum<\/span>April 1, 2015 \u2013 March 31, 2018<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>EU<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>662338<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2017<\/span><\/summary>
\"MEMS-DMFC<\/div>

MEMS-DMFC \u2013 Direct methanol fuel cell based on micro electric mechanical systems<\/h3>

The ever increasing appetite for energy in portable electronics poses a particular challenge nowadays. Because of its enormous energy storage density a methanol-based fuel cell could just be the ideal solution opposed to traditional battery technologies.
The cell contains a proton-conductive silicon-based membrane whose characteristics are crucial for the fuel cell\u00b4s efficiency.
The MEMS \u2013 DMFC project\u00b4s goal is the development of MEMS cells based on a silicon semiconductor technology that will enable the production of cost-effective fuel cells for the down market.
This AIF (Allianz Industrieforschung) sponsored project is set to run for 2.5 years and will be a cooperation with Zentrum f\u00fcr BrennstoffzellenTechnik ZBT GmbH. <\/p>\n

This project, funded by Allianz Industrieforschung (AIF) for 2.5 years, is being carried out in collaboration with the project partner Zentrum f\u00fcr BrennstoffzellenTechnik ZBT GmbH.<\/p>\n<\/div>

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Projektzeitraum<\/span>July 1, 2015, through December 31, 2017<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>18771 N<\/span><\/div><\/div><\/div><\/div><\/article>
\"SITARA<\/div>

SITARA \u2013 Self-adapting intelligent multi aperture camera modules<\/h3>

The aim of the project is the development of cost-effective, intelligent and powerful cameras with a high-dynamic range as well as ashort face-to-face dimension of less than 3 mm. These outstanding properties are to be realized by developing synchronized high-dynamic range image sensors and special micro-optical systems.. Using micro and nano structuring technology, the optical components developed as demonstrators will be comparable to the naturally occurring compound eye. <\/p>\n<\/div>

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Projektzeitraum<\/span>May 1, 2014, through September 30, 2017<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>13N12996<\/span><\/div><\/div><\/div><\/div><\/article>
\"Color<\/div>

Color Eye \u2013 high-dynamic color image sensor with new color and corrective algorithms<\/h3>

The SME company hema electronic GmbH and IMS CHIPS are cooperating on the \u201cColorEye\u201d project in developing particularly small new intelligent high-resolution video cameras based on the new HDRC\u00ae image sensor with Global Shutter technology. These cameras will be ideal for dynamic process control in sophisticated industrial applications, such as automation and assistance systems in hauling vehicles.
IMS CHIPS will be developing new color and corrective algorithms based on the new high-dynamic and high-resolution Global Shutter sensors, which were developed within the frame of the European sponsoring program CATRENE.
To improve the quality of packaged high-dynamic HDRC sensors IMS CHIPS is developing a miniature lighting test unit for optical and electric characterization under real operating conditions that can be integrated into an automatic component handler. <\/p>\n<\/div>

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Projektzeitraum<\/span>September 1, 2015, through August 31, 2017<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMWI <\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16KN037741 (BMWI\/ZIM)<\/span><\/div><\/div><\/div><\/div><\/article>
\"KATMETHAN<\/div>

KATMETHAN \u2013 Catalytic methane synthesis<\/h3>

The goal of the project is to conduct research on novel peptide-based catalysts for methane synthesis and to expand and improve the fundamental understanding of complex conversion processes. The KATMETHAN project has a total budget of 1.462 million euros and is supported by the BMBF with 995,000 euros in funding from the Energy and Climate Fund. The grant amount for IMS CHIPS is 203,000 euros. The project will run for three years, and the project management agency is Forschungszentrum J\u00fclich, Energy Technologies Division, Department of Fundamental Energy Research. <\/p>\n<\/div>

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Projektzeitraum<\/span>September 1, 2014, through August 31, 2017<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>03EK3030D<\/span><\/div><\/div><\/div><\/div><\/article>
\"Smart-LiB<\/div>

Smart-LiB \u2013 Intelligent Li ion batteries in production and use<\/h3>

The Smart-LiB project, a joint project between IMS CHIPS and the Innovationsallianz Baden-W\u00fcrttemberg (innbw) partner ZSW, was launched on October 1st, 2015, and is set to last until September 30th, 2016. This project is designed to research solutions to encompass the Li ion battery staple\u00b4s condition without the currently required wiring (SoH \u2013 State of Health, SoC \u2013 State of Charge).
The decentralized or mobile storage of electrical energy using batteries is a key technology for the 21st century energy supply. Lithium ion cells are core elements in modern hybrid and electric power since they are crucial to costs, operating distance and reliability of a vehicle. This makes the lithium ion technology a strategic element for the automobile industry in the future. <\/p>\n<\/div>

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Projektzeitraum<\/span>October 1, 2015, through March 31, 2017<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BW (MFW)<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>7-4332.62-ZSW\/45<\/span><\/div><\/div><\/div><\/div><\/article>
\"TENECOR<\/div>

TENECOR \u2013 Telemetric multimodal neonatal cortexmonitoring<\/h3>

The aim of this sub-project is the micro-electronic integration of a subsystem for safe automatic detection of EEG signals in preterm infants using a \u201celectrode Cap\u201d. The subsystem can be achieved as ASIC in addition to other components for the safe operation, error detection and data and status transmission to parent system parts of signal amplification, conditioning, and digitalisation. The subproject is an integral part of the demonstrator in the joint project designed with its fully integrated EEG \u2013 and impedance measuring circuit. <\/p>\n<\/div>

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Projektzeitraum<\/span>March 1, 2014, through February 28, 2017<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>13GW0033E<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2016<\/span><\/summary>
\"KoSiF<\/div>

KoSiF \u2013 Complex systems in foil<\/h3>

The KoSiF (Komplexe Systeme in Folie) research project researchs, evaluates and technologically adjusts the necessary technologies for additional functionalities that will be required for the manufacture of future thin and flexible products. KoSiF represents an initiative made up of industry, research facilities and universities aiming to find means of integration of thin silicon chips, thin-film components and organic electronics on one foil substrate enabling autonomous and intelligent flexible electronics. <\/p>\n

The project will realize two demonstrator, i. e. Smart Skin and Smart Switch, which will be connected to similar key technologies.<\/p>\n<\/div>

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Projektzeitraum<\/span>January 1, 2013 \u2013 June 30, 2016<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16ES00012<\/span><\/div><\/div><\/div><\/div><\/article>
\"X-MIND<\/div>

X-MIND \u2013 Analyses on extremely miniaturizid optical speedsensor<\/h3>

In the X-MIND project (Research on Extremely Miniaturized Optical Encoders), a low-cost optical encoder was developed. It was designed as an absolute encoder, offering the potential for the highest possible level of miniaturization. The design also offers the advantage of an extremely simple assembly process. For example, the encoder is completely insensitive to eccentricity of the sensor shaft. This, combined with its design using very few, low-cost optical components, offers the potential for a low-cost encoder that can open up entirely new applications, such as in medical technology or the consumer sector. <\/p>\n<\/div>

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Projektzeitraum<\/span>January 1, 2014, through April 30, 2016<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>17898 N<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>2015<\/span><\/summary>

The ETIK joint project advances EUV lithography<\/h3>

The focus is on EUV lithography which uses extreme ultraviolet (EUV) light to structure microchips. This new type of technology will reach production level by the end of this year and confer structures by 20 nano meters. ETIK (\u201cEUV projection optics for 14 nm solution\u201d) will even take it one key step further. It aims at improving the solution reached by using EUV lithography by at least 14 nano meters.
IMS CHIPS assures the quality of projection objective by making optical power components available. <\/p>\n

IMS CHIPS helped ensure the quality of the projection lens by supplying high-performance optical components.<\/p>\n<\/div>

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Projektzeitraum<\/span>June 1, 2012, through December 31, 2015<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16N12257<\/span><\/div><\/div><\/div><\/div><\/article>
\"PEPDIODE<\/div>

PEPDIODE \u2013 Peptide based diodes for solar cells<\/h3>

This EU project involves 6 partners from 4 countries who are working on a groundbreaking peptide-based study aimed at enabling the further development of novel solar cells.<\/p>\n<\/div>

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Projektzeitraum<\/span>August 1, 2011 \u2013 July 31, 2015<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>EU<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>256672<\/span><\/div><\/div><\/div><\/div><\/article>
\"INSERO3D<\/div>

INSERO3D \u2013 Intelligent Service Robotics by means of 3D image capture and processing<\/h3>

INSERO3D specifically builds upon and further develops the results of the PRONTO-KonKaMis project in the areas of integrating plastic, silicon, and sensor technologies, as well as the necessary assembly and interconnection techniques for the design and manufacture of digital sub-miniature cameras. The goal of the project is to develop technological solutions for the intelligent optical positioning of service robots in space or relative to an interaction object. <\/p>\n<\/div>

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Projektzeitraum<\/span>October 1, 2012 \u2013 June 30, 2015<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16SV5998<\/span><\/div><\/div><\/div><\/div><\/article>
\"ITAS<\/div>

ITAS \u2013 Integration Technology for Autonomous Sensor Systems<\/h3>

Autonome Sensormodule werden zuk\u00fcnftig marktbestimmend, sofern energieeffiziente und kleinbauende L\u00f6sungen realisiert werden k\u00f6nnen.
Das Projekt ITAS entwickelt eine Technologieplattform f\u00fcr Integrationstechnologien autonomer Sensormodule mit dem Fokus auf Miniaturisierung, Energie- und Dateneffizienz unter Nutzung kabelloser Kommunikationsschnittstellen und Energy Harvesting.<\/p>\n<\/div>

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Projektzeitraum<\/span>October 1, 2012 \u2013 June 30, 2015<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16SV5970K16SV5970K<\/span><\/div><\/div><\/div><\/div><\/article>
\"SMART<\/div>

SMART IMPLANT: Implantable electronics for diagnostic and therapeutic purposes<\/h3>

MST solutions for integrative sensors, actors as well as electronic building groups for energy and data management in complex active medical micro implants for diagnostic, therapeutic and rehabilitation purposes.<\/p>\n<\/div>

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Projektzeitraum<\/span> October 1, 2012 \u2013 June 30, 2015<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16SV5986<\/span><\/div><\/div><\/div><\/div><\/article>
\"FlexPacFAM<\/div>

FlexPacFAM \u2013 Flexible packaging of microsystem components based on printed circuit board substrates using film-assisted molding<\/h3>

The recently finalized FlexPacFAM project researched alternative circuit board-based packaging solutions and developed, among else, a QFN housing-compatible package that can also be produced in small series.<\/p>\n<\/div>

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Projektzeitraum<\/span>01.12.2012-31.01.2015<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF\/AIF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>17602 N<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details>
<\/span>through 2014<\/span><\/summary>
\"PRONTO<\/div>

PRONTO \u2013 Production Platform for Microsystems<\/h3>

The PRONTO platform provides industry with a tool for testing and implementing a wide variety of microsystems technologies in their own product innovations, regardless of sector. In addition, PRONTO offers support in setting up mass production. <\/p>\n<\/div>

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Projektzeitraum<\/span> July 1, 2010 \u2013 December 31, 2014<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>MWK Ministry of Science and the Arts<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>1499 \/ 685 37<\/span><\/div><\/div><\/div><\/div><\/article>

OASIS \u2013 Online Failure Prediction for Microelectronic Circuits Using Aging Signatures<\/h3>

Microelectronic circuits are subject to aging that limits their service life. This project aims to develop online, in-field methods for evaluating circuit performance and remaining service life in order to predict failures caused by aging processes. <\/p>\n<\/div>

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Projektzeitraum<\/span>01.08.2011-31.12.2014<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span> DFG Project<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>WU 245\/11-1<\/span><\/div><\/div><\/div><\/div><\/article>
\"RTFIR<\/div>

RTFIR \u2013 Affordable Thermal Imaging Cameras for Night Vision Devices in Any Car<\/h3>

Fundamentals of process engineering for the design of IR optics using precision hot-forming processes; subproject: Development and design of an FIR-sensitive camera pixel array and an appropriate signal processing circuit.<\/p>\n<\/div>

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Projektzeitraum<\/span>01.10.2010-30.06.2014<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>16SV5131<\/span><\/div><\/div><\/div><\/div><\/article>
\"ModFlex<\/div>

ModFlex \u2013 modular current measuring system for the measurement on nonplanar surfaces as well as in non-accessible measurement environments<\/h3>

The ModFlex project developed a very thin, mechanically flexible thermoelectric microsystem-based flow sensor with associated electronics\u2014which are also thin and flexible\u2014and telemetric power and data transmission.<\/p>\n<\/div>

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Projektzeitraum<\/span>01.10.2011-01.02.2014<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>ZUTECH \/ BMWi<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>17192N\/2<\/span><\/div><\/div><\/div><\/div><\/article>
\"HiDRaLoN<\/div>

HiDRaLoN \u2013 High Dynamic Range Low Noise CMOS Imagers<\/h3>

In order to research concepts for a new generation of image sensors with high dynamic range and high resolution combined with low noise using alternative CMOS technology, a strong German project network has been formed within the European CATRENE research project HiDRaLoN (High Dynamic Range Low Noise CMOS Imagers). After approx. 3 years the research work will be successfully completed. <\/p>\n<\/div>

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Projektzeitraum<\/span>May 1, 2009 \u2013 June 30, 2012<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>EU<\/span><\/div><\/div>
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F\u00f6rderkennzeichen<\/span>13N10370<\/span><\/div><\/div><\/div><\/div><\/article>

EXEPT \u2013 Extreme UV Lithography Entry Point Technology Development<\/h3>

The collaborative project \u201cLithography for the 22-Nanometer Node\u201d has been successfully completed. As part of this national project\u2014which is embedded in the European EXEPT project (\u201cExtreme UV Lithography Entry Point Technology Development\u201d) led by the Dutch company ASML and part of the CATRENE cluster \u2014eight German companies and research institutions have advanced EUV lithography from basic research to a fully operational technology for the mass production of microchips at the 22-nanometer node. <\/p>\n<\/div>

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Projektzeitraum<\/span>May 1, 2009 \u2013 May 30, 2012<\/span><\/div><\/div>
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F\u00f6rdergeldgeber<\/span>BMBF<\/span><\/div><\/div><\/div><\/div><\/article>
\"HyperBraille<\/div>

HyperBraille \u2013 a graphics display for the vision impaired<\/h3>

In the Hyperbraille project, a touch-sensitive surface display was developed. Based on the successful project results, the implementation of the surface display in a product ready for series production was announced for the end of 2011. <\/p>\n<\/div>

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Projektzeitraum<\/span>2007 \u2013 October 31, 2010<\/span><\/div><\/div><\/div><\/div><\/article>
\"Chipfilm<\/div>

Chipfilm Project<\/h3>

The Chipfilm\u2122 project, funded by the Baden-W\u00fcrttemberg State Foundation on behalf of the Ministry of Economic Affairs, was successfully completed in November 2009. Scientists at the Institute for Physical Electronics at the University of Stuttgart (ipe) and at the IMS, with the support of four companies, investigated the fundamental properties of ultrathin silicon chips manufactured using the new Chipfilm\u2122 technology. <\/p>\n<\/div>

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Projektzeitraum<\/span>June 1, 2007 \u2013 November 30, 2009<\/span><\/div><\/div><\/div><\/div><\/article><\/div><\/details><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

Completed Projects 2025 HyPerStripes \u2013 intelligent and flexible cables HyPerStripes develops, evaluates and delivers technologies for long smart and flexible electronic systems that replace conventional cables and enable new products for applications with complex connections. 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