{"id":34529,"date":"2026-09-18T11:49:48","date_gmt":"2026-09-18T09:49:48","guid":{"rendered":"https:\/\/webex4.ims-chips.de\/ims_chips\/german-taiwanese-cooperation-in-microelectronics-ims-chips-at-the-2026-nstc-bmftr-annual-meeting\/"},"modified":"2026-09-30T07:29:47","modified_gmt":"2026-09-30T05:29:47","slug":"german-taiwanese-cooperation-in-microelectronics-ims-chips-at-the-2026-nstc-bmftr-annual-meeting","status":"publish","type":"post","link":"https:\/\/ims-chips.de\/en\/german-taiwanese-cooperation-in-microelectronics-ims-chips-at-the-2026-nstc-bmftr-annual-meeting\/","title":{"rendered":"German-Taiwanese Cooperation in Microelectronics: IMS CHIPS at the 2026 NSTC-BMFTR Annual Meeting"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-post\" data-elementor-id=\"34529\" class=\"elementor elementor-34529 elementor-34519\" data-elementor-post-type=\"post\">\n\t\t\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-c49cf13 elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"c49cf13\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-42cca09\" data-id=\"42cca09\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-19c396d elementor-widget elementor-widget-heading\" data-id=\"19c396d\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h1 class=\"elementor-heading-title elementor-size-default\">German-Taiwanese Cooperation in Microelectronics: IMS CHIPS at the 2026 NSTC-BMFTR Annual Meeting<\/h1>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-952759c elementor-section-stretched elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"952759c\" data-element_type=\"section\" data-e-type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;,&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-custom\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-33 elementor-top-column elementor-element elementor-element-f327c49\" data-id=\"f327c49\" data-element_type=\"column\" data-e-type=\"column\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div 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                     <img class=\"ims-news-slider__image\" src=\"https:\/\/ims-chips.de\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2.jpg\" data-full=\"https:\/\/ims-chips.de\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2.jpg\" alt=\"Dr. Michael Warber, Prof. Dr. Niels Quack mit Mark Lee von der National Tsing Hua University (NTHU)\" loading=\"eager\" decoding=\"async\" draggable=\"false\">\n                                                                    <button type=\"button\" class=\"ims-news-slider__zoom ims-news-slider__zoom--bottom-right\" aria-label=\"Bild vergr\u00f6\u00dfern\">\n                                        <svg viewBox=\"0 0 24 24\" aria-hidden=\"true\"><path d=\"M10.5 4a6.5 6.5 0 1 0 3.99 11.63l4.44 4.44 1.14-1.14-4.44-4.44A6.5 6.5 0 0 0 10.5 4Zm0 1.6a4.9 4.9 0 1 1 0 9.8 4.9 4.9 0 0 1 0-9.8Zm-.8 2v2.1H7.6v1.6h2.1v2.1h1.6v-2.1h2.1V9.7h-2.1V7.6H9.7Z\"\/><\/svg>\n                                    <\/button>\n                                                            <\/div>\n                                                            <div class=\"ims-news-slider__caption\">Dr. Michael Warber, Prof. Dr. Niels Quack, and Mark Lee from National Tsing Hua University (NTHU)<\/div>\n                                                    <\/div>\n                                    <\/div>\n            <\/div>\n        <\/div>\n        \t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-66 elementor-top-column elementor-element elementor-element-017489d\" data-id=\"017489d\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-64edc29 elementor-widget elementor-widget-ims-texteditor\" data-id=\"64edc29\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"ims-texteditor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<div class=\"ims-texteditor\"><div class=\"ims-texteditor__content\"><p>International research collaborations thrive on personal exchange\u2014and on looking beyond one\u2019s own project together. At the 2026 NSTC-BMFTR Annual Meeting in Munich and Erlangen, partners from Germany and Taiwan gathered to present current research projects, exchange experiences, and gain new insights for collaboration in microelectronics. <\/p>\n<p>IMS CHIPS was on site together with Mark Lee from National Tsing Hua University (NTHU) as part of the joint TEDI-SPEC project. The focus was on exchange between the participating projects as well as insights into the German research and semiconductor landscape. The program combined project presentations and networking with visits to research and industry partners.  <\/p>\n<p>Among the stops was Infineon Technologies, which provided insights into current developments and projects related to semiconductors and edge computing. On the third day of the event, the program included a visit to the Siemens Electronics Factory in Erlangen. <\/p>\n<p>Such meetings are an important opportunity\u2014especially for international research projects\u2014to bring together different professional perspectives, strengthen professional ties, and advance joint initiatives.<\/p>\n<p>Many thanks to the BMFTR, the NSTC, and everyone involved for the excellent organization, the fascinating insights, and the in-depth discussions.<\/p>\n<\/div><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>IMS CHIPS at the NSTC-BMFTR Annual Meeting 2026: international research, industry insights, and exchanges with partners.<\/p>\n","protected":false},"author":7,"featured_media":34530,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[73],"tags":[82],"class_list":["post-34529","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-nstc-bmftr-annual-meeting"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>German-Taiwanese Microelectronics Cooperation | IMS CHIPS<\/title>\n<meta name=\"description\" content=\"IMS CHIPS strengthens German-Taiwanese cooperation in microelectronics at the 2026 NSTC-BMFTR Annual Meeting, highlighting the joint TEDI-SPEC project.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ims-chips.de\/en\/german-taiwanese-cooperation-in-microelectronics-ims-chips-at-the-2026-nstc-bmftr-annual-meeting\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"German-Taiwanese Microelectronics Cooperation | IMS CHIPS\" \/>\n<meta property=\"og:description\" content=\"IMS CHIPS strengthens German-Taiwanese cooperation in microelectronics at the 2026 NSTC-BMFTR Annual Meeting, highlighting the joint TEDI-SPEC project.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/ims-chips.de\/en\/german-taiwanese-cooperation-in-microelectronics-ims-chips-at-the-2026-nstc-bmftr-annual-meeting\/\" \/>\n<meta property=\"og:site_name\" content=\"IMS CHIPS - Institut f\u00fcr Mikroelektronik Stuttgart\" \/>\n<meta property=\"article:published_time\" content=\"2026-09-18T09:49:48+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-09-30T05:29:47+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/webex4.ims-chips.de\/ims_chips\/wp-content\/uploads\/2026\/09\/NSTC-BMFTR_2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1500\" \/>\n\t<meta property=\"og:image:height\" content=\"967\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Chiara A. 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