FRAUKE – Pioneering Chip Development for Artificial Intelligence in Baden-Württemberg
As part of the FRAUKE 1 collaborative project (Fraunhofer AI Design Heilbronn 2026–2027, FRAUKE 1 Kickoff Project), IMS CHIPS is contributing its long-standing expertise in CMOS technology and application-oriented microelectronics research to help strategically shape the future development of AI chips in Baden-Württemberg. The work focuses on analyzing technological developments and creating roadmaps for modern CMOS and chiplet technologies, which will form the basis for high-performance and energy-efficient AI hardware in the future.
In addition, IMS CHIPS supports the establishment of a nationwide innovation network for chip development and chip manufacturing. The goal is to bring research institutions, companies, and other stakeholders in the microelectronics industry closer together and to jointly develop prospects for future semiconductor technologies. Through its extensive experience in the field of integrated circuits and technology transfer, the institute makes an important contribution to strengthening Baden-Württemberg’s chip ecosystem.
The FRAUKE 1 collaborative project is coordinated by the Fraunhofer Institute for Applied Solid State Physics (IAF) in Freiburg and carried out in collaboration with the University of Stuttgart—Institute for Intelligent Sensors and Theoretical Electrical Engineering (IIS)—and the Institute for Microelectronics Stuttgart (IMS CHIPS). The project will run from February 2026 to December 2027. The Baden-Württemberg Ministry of Economic Affairs, Labor, and Tourism is providing approximately 2 million euros in funding for the project.
The goal of the project is to develop a strategic foundation for the next generation of digital semiconductor technologies. To this end, roadmaps are being developed for CMOS manufacturing and chiplet technologies, with a particular focus on artificial intelligence applications. At the same time, concepts are being developed for a nationwide platform for CMOS chip development and manufacturing to bring together existing expertise from academia and industry and accelerate knowledge transfer.
The development of high-performance, energy-efficient chips is one of the key issues for the future of Baden-Württemberg. Key industries such as the automotive industry, mechanical engineering, automation technology, and industrial digitalization are increasingly reliant on innovative semiconductor solutions. FRAUKE lays important strategic groundwork in this area and strengthens the state’s technological independence in the field of microelectronics.
The project is closely linked to the activities of the Innovation Park for Artificial Intelligence (IPAI) in Heilbronn and the state initiative “Chip Connect BW.” Together with other partners from the fields of research, business, and politics, a powerful network is being created that will further establish Baden-Württemberg as a leading hub for microelectronics, semiconductor technologies, and AI-driven chip development.
Through its participation in FRAUKE 1, IMS CHIPS helps identify promising future technology fields at an early stage, strategically align research and development activities, and strengthen collaboration between academia and industry in a sustainable manner. In doing so, the institute makes an important contribution to the long-term competitiveness and innovative strength of Baden-Württemberg as a hub for microelectronics.