MEMS. For precision micromechanics and membranes in scalable applications.
IMS CHIPS develops and fabricates microelectromechanical systems (MEMS) and large-area membranes >exceeding 100 cm² for advanced research and industrial applications. Our silicon wet and dry etching capabilities enable complex micromechanical structures with feature sizes down to 50 nm and aspect ratios of up to 1:50. Multilevel patterning with overlay accuracy of ±25 nm and through-wafer etching provide additional flexibility for demanding MEMS designs.
Our capabilities also include post-processing of CMOS foundry wafers, from selective thinning and membrane formation to layer deposition and patterning. This combination of high-precision silicon micromachining and CMOS post-processing supports the development of integrated MEMS solutions from initial concept through scalable implementation.
From the MEMS concept. To the validated prototype.
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“Every MEMS project starts with understanding what the application needs to achieve. Together, we define the required functionality, materials, dimensions, geometry, and level of integration. From there, we develop the appropriate process flow, evaluate feasibility, fabricate prototypes, and refine the design toward a robust, scalable solution. If you have a MEMS challenge in mind, I’d be happy to discuss it with you.”
Membranes. Individually-designed for your application.
We fabricate membranes in a range of geometries, dimensions, and materials to match the requirements of the application. Structures can be patterned directly into the membrane to create stencil masks or, for Si₃N₄ membranes, into thin chromium absorber layers to produce absorber masks. The result is a membrane solution engineered for applications in optics, sensing, and energy systems.
Micromechanics. For complex silicon structures with feature sizes up to 50 nm.
THE IMS CHIPS SOI wafer process and the two in-house variable-shaped electron-beam writers enable silicon structures with feature sizes down to 50 nm in membranes only a few hundred nanometers thick. For larger-scale structures, our in-house stepper, laser, and contact lithography capabilities provide a cost-effective alternative, including structures etched through the entire wafer substrate.
This combination gives developers access to fabrication technologies spanning nanoscale features and macroscopic silicon structures within a single technology portfolio.
CMOS post-processing. MEMS integration directly onto finished CMOS chips.
Fully processed CMOS wafers can be further modified at IMS CHIPS through deep silicon etching, selective thinning, layer deposition, and additional patterning. These processes are available for both foundry wafers and substrates processed in-house.
Precise alignment enables CMOS circuitry and micromechanical components to be integrated and electrically interconnected. Our assembly, adhesive bonding, and chip-bonding capabilities also make it possible to combine multiple active and passive dies into complex chip stacks with sub-micrometer alignment accuracy. This provides a flexible route to highly integrated microsystems for a broad range of applications.
References. For proven MEMS performance in demanding systems.
IMS CHIPS MEMS and membrane technologies have been implemented across a range of advanced applications. Examples include optoelectronic microsystems for beam deflection in electron-beam writers and scanning electron microscopes, silicon photonics, and membrane-based energy systems such as direct methanol fuel cells (DMFCs).
Our technologies are also used to fabricate stencil masks for beam shaping, polarization filters, coating processes, and specialized micromechanical components.