About us » News »

German-Taiwanese Cooperation in Microelectronics: IMS CHIPS at the 2026 NSTC-BMFTR Annual Meeting

Dr. Michael Warber, Prof. Dr. Niels Quack mit Mark Lee von der National Tsing Hua University (NTHU)
Dr. Michael Warber, Prof. Dr. Niels Quack, and Mark Lee from National Tsing Hua University (NTHU)

International research collaborations thrive on personal exchange—and on looking beyond one’s own project together. At the 2026 NSTC-BMFTR Annual Meeting in Munich and Erlangen, partners from Germany and Taiwan gathered to present current research projects, exchange experiences, and gain new insights for collaboration in microelectronics.

IMS CHIPS was on site together with Mark Lee from National Tsing Hua University (NTHU) as part of the joint TEDI-SPEC project. The focus was on exchange between the participating projects as well as insights into the German research and semiconductor landscape. The program combined project presentations and networking with visits to research and industry partners.

Among the stops was Infineon Technologies, which provided insights into current developments and projects related to semiconductors and edge computing. On the third day of the event, the program included a visit to the Siemens Electronics Factory in Erlangen.

Such meetings are an important opportunity—especially for international research projects—to bring together different professional perspectives, strengthen professional ties, and advance joint initiatives.

Many thanks to the BMFTR, the NSTC, and everyone involved for the excellent organization, the fascinating insights, and the in-depth discussions.