Our History. Milestones Since 1983.
IMS CHIPS was founded in 1983 with a clear vision: to make microelectronics research, development, and manufacturing accessible to industry and users. Despite political and financial challenges, the institute was established as a foundation under public law within just a few months.
What began as a response to a technological gap continues to define us today: industry-oriented research, successful technology transfer, and innovations that move beyond the laboratory into real-world applications.
Our history begins not simply with a date, but with a decision made under considerable time pressure.
In 1982/83, North Rhine-Westphalia and the Fraunhofer Society were looking for a director for a planned microelectronics institute in Duisburg. They offered the position to Stuttgart-based Professor Ernst Lüder.
Baden-Württemberg wanted to retain Lüder in Stuttgart, and Minister-President Lothar Späth intervened personally.
Against this backdrop, the University of Stuttgart and SEL (Standard Elektrik Lorenz) proposed establishing a “Society for Microelectronics” in February 1983. Their objective was clear: to create accessible development and manufacturing capabilities for microelectronic circuits, including for industrial users.
The initiative faced considerable opposition. Fraunhofer and the German Federal Ministry for Research and Technology (BMFT) opposed the establishment of a second, similar institution and saw no need for it. Federal funding for the Stuttgart initiative was therefore not expected.
Despite these obstacles, the institute was founded in Stuttgart in July 1983 as a foundation under public law – less than six months after the initial proposal.
The starting point was a clear gap in the technological landscape: there was no generally accessible institution supporting small-series production and the further development of innovative circuits.
This continues to shape our identity today: industry-oriented, committed to technology transfer, and open to collaboration – developing technologies that move beyond the laboratory and into practical applications.
Key Milestones. Our Development at a Glance.
From Photonics Pilot Production. To Technological Sovereignty.
2026
- P4Q: Responsibility for the thin-film lithium niobate (TFLN) manufacturing line within a major European project to industrialize photonic quantum technologies.
- FRAUKE: Strategic contribution to shaping the next generation of AI chips and semiconductor technologies in Baden-Württemberg.
- QuID Neuro: Transfer of quantum sensing into medicine for highly sensitive biomarker detection in brain tumor diagnostics.
- “From Cleanroom. To Greenroom.” New perspectives and solutions for energy-efficient and sustainable cleanroom operations.
2025
- Launch of the pilot production line for photonic AI chips in collaboration with Q.ANT.
- Prof. Dr. Niels Quack assumes the position of Managing Director of the institute.
- Strengthening Europe’s technological sovereignty through research and pilot manufacturing.
- Expansion of activities in quantum technologies, photonics, and sensor technologies.
Quantum Technologies, AI and Sustainable Microelectronics
2024
- Energy efficiency and sustainable cleanroom operations established as strategic priorities for the future.
2023
- Agreement with Q.ANT on the joint manufacturing of quantum chips.
- Expansion of nanotechnology infrastructure through REACT-EU funding.
- Significant reduction in energy consumption through comprehensive sustainability measures.
2022
- Development of an in-house edge AI chip featuring a RISC-V processor and AI accelerators.
- Launch of the PhotonQ project for integrated photonic quantum chips.
2021
- Participation in the QSens Future Cluster for quantum sensing.
- University of Stuttgart Publication Award for research in silicon photonics.
Photonics, Medical Technology and Artificial Intelligence
2020
- Contribution to the German Future Prize through high-precision optical components for extreme ultraviolet (EUV) lithography.
- Development of sensor technologies for Industry 4.0 applications within the BW-CPS project.
2019
- Launch of the NeMoH project to develop neuromorphic hardware for artificial intelligence.
- Recognition with the Dürr Supplier Award for Innovation & Technology.
2018
- Cover feature in an IEEE journal highlighting adaptive layout methods for flexible foil-based systems.
- Advances in flexible electronics and silicon-in-foil technologies.
2017
- Funding of more than €3 million to transition the research infrastructure to 200 mm wafer technology.
2016
- 30th anniversary of the institute.
- Recognition as one of the “100 Places for Industry 4.0 in Baden-Württemberg.”
Infrastructure and Emerging Technology Fields
2015
- Launch of the SeNaTe EUV mask project.
- Completion of the MicroTEC Südwest Leading-Edge Cluster.
2014
- Prof. Dr. Joachim Burghartz receives the IEEE J. J. Ebers Award, one of the world’s most prestigious distinctions in microelectronics.
2013
- Inauguration of the new cleanroom.
- World record in energy-efficient photonic integration in silicon.
2011
- Establishment of the Innovation Alliance Baden-Württemberg (innBW), with IMS CHIPS as a participating institution.
- Start of construction work on the cleanroom expansion.
2010
- Selection of MicroTEC Südwest as a Leading-Edge Cluster.
- ASICs developed by IMS CHIPS are deployed aboard the TanDEM-X radar satellite.
Expanding Research and International Visibility
2008
- 25th anniversary of the institute.
- Launch of the ProMikron project to advance ultrathin chip technologies.
2007
- First clinical trials of a retinal chip for blind patients.
- Collaboration with Bosch on the development of ultrathin microchips.
2006
- Presentation of Chipfilm® technology for ultrathin silicon chips at the International Electron Devices Meeting (IEDM) in San Francisco.
- Best Paper Award at Photomask Japan.
2005
- Prof. Dr. Joachim Burghartz assumes leadership of the institute.
- Manufacturing of the first full-field EUV masks for ASML.
2002
- Development of radiation-hardened image sensors for space applications.
- The one-millionth ASIC leaves the IMS manufacturing facility.
- Establishment of IMS VISION GmbH.
Technological Foundations and Early Innovations
1999
- Presentation of the retinal implant concept in collaboration with research and medical partners.
- First color images captured using HDRC® cameras.
1998
- Development of the world’s first mobile phone with an integrated GPS positioning module as part of the European MORE-Phone project.
1993
- International recognition for research on the 3D integration of CMOS circuits.
- ISO 9001 certification.
1992
- Launch of the educational program “Students Make Chips” (SMC).
- Filing of the foundational patent for HDRC® image sensors.
1991
- Transition of manufacturing operations to 6-inch wafer technology.
- Development of innovative wafer bonding technologies and early silicon-on-insulator (SOI) applications.
Foundation and Establishment
1986
- Completion of the cleanroom and commissioning of the first semiconductor manufacturing line.
- Official inauguration of the institute building.
1985
- Launch of the European PROMETHEUS research project, an early initiative focused on intelligent driver assistance systems.
1983
- Prof. Dr. Ernst Lüder becomes the institute’s founding director.
- Establishment of the Institute for Microelectronics Stuttgart (IMS) as a foundation.
Ernst Lüder
Bernd Höfflinger
Joachim Burghartz
Jens Anders
Niels Quack